EUV Roadmap to 280 Wafers Per Hour and Chips With 0.5 Nanometer Features
EUV roadmap updated with up to 250wph and 280 wph (wafers per hour) throughput and better overlay (alignment accuracy); probably higher ASPs as productivity improves with each version.
Chips will get to 0.5 Nanometer features in 2030-2032.
DUV is the workhorse for ASML and the industry. 525M DUV exposures in CY24 and that will grow to 900M+ by CY30. Updat…
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